Bismuth Tin Indium Silver (BiSnInAg)

Liquid metal heat sink is a metal foil with a melting point between 58 °C and 200 °C, which is processed from indium, tin, bismuth, zinc, silver, aluminum, etc. Its high electrical conductivity and high thermal conductivity make it widely used in various heat dissipation, heat conduction, sealing and other fields. Metal thermal conductive sheets can be elemental metal foils or bidisternary, ternary and quaternary alloy sheets, with thicknesses ranging from 0.01 to 7mm. When the temperature of the heating source (such as CPU/GPU) exceeds the melting point, the metal thermal conductive sheet will melt into liquid, fully filling the gap between the heating source and the heat sink, forming a thermal channel and quickly conducting heat. When the temperature drops below the melting point, the metal thermal conductive sheet will solidify into a foil, liquid and solid state can be converted into each other under the action of heat, and the transformation does not affect its thermal conductivity, long service life, excellent anti-aging performance. Liquid metal heat sinks comply with EU RoHS standards and are non-toxic, and can be applied to the customization needs of various shapes and melting points.

Dihedral Technology(DHD) Co., Ltd. manufacture and processing/provide multiple specifications and high quality BiSnInAg crystal,targets,materials.

Applications

• Heat dissipation and thermal conductivity
• Sealing field
• Used as a phase change material for CPU/GPU heat dissipation
• Can replace aluminum and copper sheets

Features

• Metal foils with melting points between 58°C and 202°C
• High electrical and thermal conductivity performance
• Processed from indium, tin, bismuth, zinc, silver, aluminum, etc
• Ability to adjust melting point, thickness and shape according to different application requirements
• When the temperature is greater than its melting point, it can be melted into a liquid to fill the gap to form a hot channel to achieve cooling
• When the temperature drops below the melting point, it can solidify into foil, and the liquid and solid state can be converted into each other under the action of heat
• EU RoHS compliant and non-toxic

  • Component BiSnInAg
    Thermal Conductivity >50W/m·K
    Packaging Specification 100mm X 50mm
    Electrical Conductivity 3 X 10^6 S/m
    Viscosity 58°C, phase change material
    Operating Temperature -50°C to 600°C
    Volatile Rate <0.001%
    Corrosiveness Non-corrosive